• - 交流-直流(AC-DC)控制器和稳压器
• - 直流-直流(DC-DC)控制器、转换器和稳压器
• - 电压和电流管理
• - 通讯IC
• - 驱动器
• - 热管理

• - 时钟及数据分配
• - 标准逻辑

• - 放大器和比较器
• - 模拟开关
• - 数字电位计
• - 接口
• - EMI和RFI滤波器

• - EEPROM存储器
• - 非易失性只读存储器(NVRAM)
• - SRAM存储器

说明

This octal buffer and line driver is designed specifically for low-voltage (3.3-V) V_CC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The SN74LVTH244A is organized as two 4-bit line drivers with separate output-enable (OE)\ inputs. When OE\ is low, the device passes data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

特性

• Controlled Baseline
  • One Assembly/Test Site, One Fabrication Site
• Extended Temperature Performance of –40°C to 125°C
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree
• Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V V_CC)
• Typical V_OLP (Output Ground Bounce)
     <0.8 V at V_CC = 3.3 V, T_A = 25°C
• Supports Unregulated Battery Operation Down to 2.7 V
• I_off and Power-Up 3-State Support Hot Insertion
• Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
• Latch-Up Performance Exceeds 500 mA Per JESD 17
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.