• Available in the Texas Instruments NanoFree™ Package
• Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.65-V to 5.5-V Power-Supply Range
• V_CC Isolation Feature — If Either V_CC Input Is at GND, Both Ports Are in the High-Impedance State
• DIR Input Circuit Referenced to V_CCA
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial-Power-Down Mode Operation
• Max Data Rates
  • 420 Mbps (3.3-V to 5-V Translation)
  • 210 Mbps (Translate to 3.3 V)
  • 140 Mbps (Translate to 2.5 V)
  • 75 Mbps (Translate to 1.8 V)
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
• 4000-V Human-Body Model (A114-A)
• 200-V Machine Model (A115-A)
• 1000-V Charged-Device Model (C101)

DESCRIPTION/ORDERING INFORMATION

This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track V_CCA. V_CCA accepts any supply voltage from 1.65 V to 5.5 V. The B port is designed to track V_CCB. V_CCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.

The SN74LVC2T45 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input activate either the B-port outputs or the A-port outputs. The device transmits data from the A bus to the B bus when the B-port outputs are activated, and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW level applied to prevent excess I_CC and I_CCZ.

The SN74LVC2T45 is designed so that the DIR input circuit is supplied by V_CCA.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The V_CC isolation feature ensures that if either V_CC input is at GND, both ports are in the high-impedance state.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package